Call For Applications: ITU/Huawei Generation Connect Young Leadership Program 2024 (up to $10,000 grant)
Generation Connect Young Leadership Program (GCYLP) is an exciting program to engage, empower, and inspire young digital leaders and changemakers. GCYLP aims to support young visionaries from around the world who propose creative, far-reaching, innovative, and feasible community-driven projects aimed at creating a more inclusive and empowered digital future.
International Telecommunication Union (ITU) in partnership with Huawei, is providing guidance, training, and financial support to 30 young fellows per year to enable them to practically implement digital development projects in their diverse communities across the world. Through this program, young leaders have the unique opportunity to make new digital development ideas a reality, or to expand the impact of their existing projects!
Eligibility Criteria:
- Open to young persons aged 18-28;
- Be interested in making real impact in your communities by leading your own digital development project;
- Be currently enrolled or recently graduated from a tertiary education institution from a STEM (Science, Technology, Engineering and Mathematics) or a demonstrably STEM-related academic program;
- Be able to communicate in English, the main language of the program. This language requirement is to ensure that all fellows can benefit from the planned offerings of training, networking, and events.
Benefits:
- Virtual mentorship and leadership training sessions from ITU and Huawei.
- Participation in an in-person global training week (location TBC).
- Up to USD $10,000 grant to implement a digital development project of your choice. All 30 selected fellows will receive an initial USD $5,000 grant towards the implementation of a digital development project of their choice. The most impactful projects at the end of the year will receive an extra USD $5,000 grant to scale up.
Application Process
Complete the application form by the deadline of 23:59 CET on Saturday, 23 March 2024. This form is available in Arabic, Chinese, English, French, Russian, and Spanish.
Deadline: March 23, 2024
Click HERE to Apply
